06
Nov
Nov
News
SCIENTIFIC CERTIFICATION: Semiconductor Nickel Plating Achieves 5B Adhesion and 240 Hours of Corrosion Resistance.
SCIENTIFIC EVIDENCE FOR THE 1-STEP TECHNOLOGY
Many manufacturers worry that process shortening might compromise quality. Dragon V asserts that our Semiconductor System is not only faster, but the plating layer meets rigorous international standards, proving the superior durability of the direct deposit.
PLATING LAYER CERTIFICATION RESULTS
Data collected from independent labs, directly compared against stringent international ASTM standards:
| CERTIFICATION CRITERIA | EVALUATION STANDARD | DENBP/ST-01 RESULT | SIGNIFICANCE |
| Adhesion | ASTM D3359 (Cross-hatch test) | 5B (Highest Grade) | Absolute adhesion onto the Zinc substrate; no peeling under mechanical stress. |
| Corrosion Resistance | ASTM B117 (Continuous Salt Spray Test) | $\ge$ 240 hours | Superior protection against corrosion in harsh environments, meeting standards for the automotive and auxiliary industries. |
| Microstructure | SEM Analysis | Compliant | The layer structure is homogeneous and non-porous, unlike the compromised deposit from uncontrolled galvanic displacement. |
SCIENTIFIC BASIS OF DURABILITY
The 5B quality and high corrosion resistance are achieved thanks to the advanced Passivation mechanism of the Semiconductor System. The electrolyte uses the Complex Compound and Phosphorous acid to create a stable Zinc locking layer. The Nickel deposit then forms on this completely stable foundation, ensuring maximum durability and longevity.
